Gallium Arsenide Standard Specifications

GaAs

Gallium Arsenide

Standard specifications*

Vertical Gradient Freeze (VGF) Single Crystals

Material
Semiinsulating

Semiconducting

Dopant
Undoped

Si

Zn

Type of conductivity
n

n

p

Carrier concentration, cm^-3
-

5x10¹⁷ - 3x10¹⁸

5x10¹⁸ - 3x10¹⁹

Specific Resistivity, Ohm.cm
>1x10⁷

-

-

Mobility, cm²/V.s
>5000

2400-1200

70-40

EPD, cm^-2
Ø50.8 mm

<5000

<500 or <5000

<500 or <5000

Liquid Encapsulated Czochralski (LEC) Single Crystals

Material		Semiinsulating	Semiconducting
Dopant		Undoped	Si or Te	Zn
Type of conductivity		n	n	p
Carrier concentration, cm^-3		-	1x10¹⁷ - 3x10¹⁸	1x10¹⁷ - 3x10¹⁹
Specific Resistivity, Ohm.cm		>1x10⁷	-	-
Mobility, cm²/V.s		>5000	4200-1200	170-40
EPD, cm^-2	Ø50.8 mm Ø76.2 mm	<5x10⁴ or <8x10⁴ <8x10⁴ or <1x10⁵	<5x10⁴ or <8x10⁴ <8x10⁴ or <1x10⁵	<5x10⁴ or <8x10⁴ <8x10⁴ or <1x10⁵

Wafers

Diameter, mm
50.8 ± 0.3 , 76.2± 0.3

Thickness, mm
350 ± 15, 400 ± 15 ,450 ± 15, 500 ± 15

Surface orientation
(100), (111), (110), (211), (310)

Orientation tolerance
   ± 0.5°          ± 0.1°

Off orientation

(1 - 10) ± 0.1° towards the specified face

Primary and secondary flats
according to SEMI M9 Standard (US SEMI or E/J SEMI) for (100), for other orientation-according to customer choice

Surface finishing
                      face side
                      back side

"epi-ready" polished
polished or lapped and etched

Packing
Single wafer container sealed in two bags: inner bag – vaccumized, outer bag – inert gas filed

* Single crystals and wafers with nonstandard specifications are available upon request.

[Home page] [III-V Semiconductor Wafers and Crystals]

GIRMET Ltd. 5, B.Tolmachevsky per., Moscow 119017, Russia
Tel: (7 495)956-0918, fax: (7 495)956-4944
E-mail: sales@girmet.com

Diameter, mm	50.8 ± 0.3 , 76.2± 0.3
Thickness, mm	350 ± 15, 400 ± 15 ,450 ± 15, 500 ± 15
Surface orientation	(100), (111), (110), (211), (310)
Orientation tolerance	± 0.5° ± 0.1°
Off orientation	(1 - 10) ± 0.1° towards the specified face
Primary and secondary flats	according to SEMI M9 Standard (US SEMI or E/J SEMI) for (100), for other orientation-according to customer choice
Surface finishing face side back side	"epi-ready" polished polished or lapped and etched
Packing	Single wafer container sealed in two bags: inner bag – vaccumized, outer bag – inert gas filed