SPUTTERING TARGETS     Si/Al
 


GIRMET Ltd. has launched new targets for magnetron sputtering and electron-beam evaporation based on Silicon Aluminum alloy with Aluminum content in range 1-10% wt. Patented production process ensures an even distribution of Aluminum throughout the targets. The targets show improved mechanical properties under thermal overloading and promise good adhesion to plastics. Deposited thin films are completely reproducible due to increase of maximal specific power in sputtering zone. Replacement of standard Silicon targets to Silicon/Aluminum targets provides high quality sputtered films with lower cost value.

The targets available in various fabricated forms: rectangular, plate, disk, torus and multi-piece construction any bevel joint between tiles. Metal pre-coating for bonding and soldering onto backing plate also available.

Al content, % wt. 3 – 10

Purity, % wt.

99.0 – 99.99

Resistivity, Ohm.cm

0.02 – 0.01


The complete control on every stage of production process starting from raw material and further up to finishing and certification provides high quality goods.

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GIRMET Ltd.  5, B.Tolmachevskij per., Moscow 119017, Russia
Tel: (7 495)956-0918, fax: (7 495)956-4944
E-mai
l:
sales@girmet.com